Bi-Component Bonding
Technical Specifications
Our DG-TCSE series cures in 8 hours at ambient air, or in 15 minutes at 80 ° C. Its mixing ratio is 1: 1.
It remains removable in case of need of repair of your equipment.
The DG-TCSE is available in 1 + 1Kg pots. It can also be supplied in specific packaging.
| Reference | Thermal Conductivity (W/mK) | Hardness (Shore00) | Density (g/cc) |
|---|---|---|---|
| DG- TCSE100 | 1 | 80 | 1.5 |
| DG- TCSE150 | 1.5 | 80 | 1.7 |
| DG- TCSE200 | 2 | 80 | 2.6 |
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Free download of the technical datasheet
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