Thermal Dispensing FIP
Technical Specifications
Due to its softness, this paste is a real alternative to the softest TIM thermal interfaces. It fills the surface roughness between your electronic power component and your heat sink without mechanical stress.
The DG-FIP is available in a 300 CC cartridge or in specific packaging.
| Reference | Thermal Conductivity (W/mK) | Hot Disk | Thermal Conductivity (W/mK) | ASTMD5470 | Density (g/cc) | Compression @3mm, 60PSI (%) |
|---|---|---|---|---|
| DG-FIP900P | 9.0 | 12.0 | 3.4 | 62 |
| DG-FIP600P | 6.0 | 8.0 | 3.2 | 65 |
| DG-FIP350P | 3.5 | 4.5 | 3.2 | 70 |
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Free download of the technical datasheet
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