Silicone-Free Thermal Pad
Technical Specifications
DG-SFP thermal interfaces are available as sheets. We also manufacture quickly and in a reproducible way on our numeric control cutting machines the parts in shape corresponding to your equipment.
| Reference | Thermal Conductivity (W/mK) –ASTM D5470 | Density (g/cc) | Breakdown Voltage (VAC/mil) |
|---|---|---|---|
| DG-SFP300 | 3.0 | 2.92 | ≥180 |
| DG-SFP500 | 5.0 | 3.30 | ≥180 |
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Free download of the technical datasheet
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